JPS6161703B2 - - Google Patents
Info
- Publication number
- JPS6161703B2 JPS6161703B2 JP4452681A JP4452681A JPS6161703B2 JP S6161703 B2 JPS6161703 B2 JP S6161703B2 JP 4452681 A JP4452681 A JP 4452681A JP 4452681 A JP4452681 A JP 4452681A JP S6161703 B2 JPS6161703 B2 JP S6161703B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- dissipating member
- heat
- heat dissipating
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4452681A JPS57159050A (en) | 1981-03-26 | 1981-03-26 | Liquid cooled module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4452681A JPS57159050A (en) | 1981-03-26 | 1981-03-26 | Liquid cooled module |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57159050A JPS57159050A (en) | 1982-10-01 |
JPS6161703B2 true JPS6161703B2 (en]) | 1986-12-26 |
Family
ID=12693959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4452681A Granted JPS57159050A (en) | 1981-03-26 | 1981-03-26 | Liquid cooled module |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57159050A (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040051A (en) * | 1988-12-05 | 1991-08-13 | Sundstrand Corporation | Hydrostatic clamp and method for compression type power semiconductors |
DE19911475A1 (de) * | 1999-03-15 | 2000-10-12 | Gruendl & Hoffmann | Gehäuse für elektronische Schaltungen |
US8059404B2 (en) * | 2008-10-09 | 2011-11-15 | GM Global Technology Operations LLC | Power inverters |
-
1981
- 1981-03-26 JP JP4452681A patent/JPS57159050A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57159050A (en) | 1982-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5436793A (en) | Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member | |
US10410954B2 (en) | Cooling module, water-cooled cooling module and cooling system | |
US4884169A (en) | Bubble generation in condensation wells for cooling high density integrated circuit chips | |
US4704658A (en) | Evaporation cooling module for semiconductor devices | |
US4612978A (en) | Apparatus for cooling high-density integrated circuit packages | |
US4944344A (en) | Hermetically sealed modular electronic cold plate utilizing reflux cooling | |
US4531146A (en) | Apparatus for cooling high-density integrated circuit packages | |
TWI382507B (zh) | Semiconductor package | |
JPH08340189A (ja) | 沸騰冷却装置 | |
US5343360A (en) | Containing and cooling apparatus for an integrated circuit device having a thermal insulator | |
JPH06120380A (ja) | 半導体デバイス用熱分配装置 | |
EP2061079B1 (en) | Semiconductor package and semiconductor package assembly | |
JPH0330458A (ja) | チツプ冷却用回路モジユール | |
KR20020042421A (ko) | 히트 파이프 및 열전 냉각기를 이용한 조밀한 칩 패키징용장치 | |
CN110030629A (zh) | 一种空调室外机和空调器 | |
JPS59154B2 (ja) | 電子機器の筐体 | |
JP3424717B2 (ja) | 発熱素子実装半導体装置 | |
JPS6161703B2 (en]) | ||
EP2002194A2 (en) | Low cost boiling coolers utilizing liquid boiling | |
JPS6144450Y2 (en]) | ||
JP2002026214A (ja) | 電子部品冷却装置 | |
CN223024822U (zh) | 液冷式散热器 | |
JP2718136B2 (ja) | 樹脂封止型半導体装置 | |
JP3489247B2 (ja) | 沸騰冷却装置 | |
JPS6332270B2 (en]) |